Piese comunicatii

    SEAP
    ID
    DA34275070
    Data
    18 Octombrie 2023
    Valoare
    5.425 RON
    Stare
    Oferta acceptata
    Autoritatea contractantaLocalitate
    Sibiu, Sibiu
    FurnizorTipul contractului
    Furnizare
    Cod CPVDescriere:
    Piese comunicatii
    Achizitii
    325 RON
    Cantitate: 5
    Unitate masura: bucata
    Placa de baza ASUS H110M-A/DP, Socket 1151
    PROCESOR Format Micro ATX CPU Socket 1151 Chipset Intel® H110 Procesoare suportate Intel Core i5 Intel® CoreTM i3 Intel® CoreTM i5 Intel® CoreTM i7 Intel® Celeron® Intel® Pentium® Socket procesor 1 MEMORIE Tip memorie DDR4 Capacitate maxima memorie RAM 32768 MB Frecventa memorie (MHz) 2133 Suport Dualchannel Da Suport ECC Non-ECC Sloturi memorie 2 CONECTIVITATE Slot PCI PCI Express Audio integrat Realtek® ALC887-VD2 LAN integrat Realtek® 8111H Conectivitate 1 x RJ-45 2 x PS2 3 x audio jacks 1 x VGA 4 x USB 2.0 2 x USB 3.0 1 x HDMI 1 x DVI Interfata Serial ATA 4 x SATA III Conector sursa (pini) 1 x 24 pin EATX Porturi USB 2.0 4 Porturi USB 3.0 2 SLOTURI Sloturi PCI-E x16 1 Sloturi PCI-E x1 2
    760 RON
    Cantitate: 5
    Unitate masura: bucata
    Procesor Intel® Core™ i7-6700, 3.4GHz, Skylake, 8MB, Socket 1151, Tray, fara cooler
    Procesor Intel® Core™ i7-6700, 3.4GHz, Skylake, 8MB, Socket 1151, Tray, fara cooler CARACTERISTICI GENERALE Memorie Cache 8 MB Socket 1151 Frecventa procesor (MHz) 3400 MHz Turbo Boost pana la 4000 MHz Mod de operare (biti) 64 Numar nuclee 4 Numar thread-uri 8 Tehnologie de fabricatie (nanometri) 14 Cooler Da Putere termica (W) 65 W Altele Idle States Intel® 64 Intel® Virtualization Technology (VT-x) Intel® Virtualization Technology for Directed I/O (VT-d) Intel® vPro Technology Intel® VT-x with Extended Page Tables (EPT) Thermal Monitoring Technologies Enhanced Intel SpeedStep® Technology Intel® TSX-NI Intel® Turbo Boost Technology 2.0 Intel® Hyper-Threading Technology Intel® Stable Image Platform Program (SIPP) Intel® Small Business Advantage Intel® HD Graphics 530