Piese comunicatii
SEAPIDStare
DA34275070
Data18 Octombrie 2023
Valoare5.425 RON
Oferta acceptata
Autoritatea contractantaLocalitateSibiu, Sibiu
FurnizorTipul contractuluiFurnizare
Cod CPVDescriere:Piese comunicatii
Achizitii325 RON
Cantitate: 5
Unitate masura: bucata
Placa de baza ASUS H110M-A/DP, Socket 1151
PROCESOR
Format Micro ATX
CPU Socket 1151
Chipset Intel® H110
Procesoare suportate Intel Core i5
Intel® CoreTM i3
Intel® CoreTM i5
Intel® CoreTM i7
Intel® Celeron®
Intel® Pentium®
Socket procesor 1
MEMORIE
Tip memorie DDR4
Capacitate maxima memorie RAM 32768 MB
Frecventa memorie (MHz) 2133
Suport Dualchannel Da
Suport ECC Non-ECC
Sloturi memorie 2
CONECTIVITATE
Slot PCI PCI Express
Audio integrat Realtek® ALC887-VD2
LAN integrat Realtek® 8111H
Conectivitate 1 x RJ-45
2 x PS2
3 x audio jacks
1 x VGA
4 x USB 2.0
2 x USB 3.0
1 x HDMI
1 x DVI
Interfata Serial ATA 4 x SATA III
Conector sursa (pini) 1 x 24 pin EATX
Porturi USB 2.0 4
Porturi USB 3.0 2
SLOTURI
Sloturi PCI-E x16 1
Sloturi PCI-E x1 2760 RON
Cantitate: 5
Unitate masura: bucata
Procesor Intel® Core™ i7-6700, 3.4GHz, Skylake, 8MB, Socket 1151, Tray, fara cooler
Procesor Intel® Core™ i7-6700, 3.4GHz, Skylake, 8MB, Socket 1151, Tray, fara cooler
CARACTERISTICI GENERALE
Memorie Cache 8 MB
Socket 1151
Frecventa procesor (MHz) 3400 MHz
Turbo Boost pana la 4000 MHz
Mod de operare (biti) 64
Numar nuclee 4
Numar thread-uri 8
Tehnologie de fabricatie (nanometri) 14
Cooler Da
Putere termica (W) 65 W
Altele Idle States
Intel® 64
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® vPro Technology
Intel® VT-x with Extended Page Tables (EPT)
Thermal Monitoring Technologies
Enhanced Intel SpeedStep® Technology
Intel® TSX-NI
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology
Intel® Stable Image Platform Program (SIPP)
Intel® Small Business Advantage
Intel® HD Graphics 530