Prime Si + wet SiO2 wafer 2 inch, thinckness=279 ±25µm, (100), 1-side polished, p=type (Boron), TTV<10 µm, 1-10 Ohm cm, 500nm dry/wet/dry thermally grown SiO2, INV: 474597
SEAPIDStare
DAN1985776
Data publicare22 August 2023 - 12:36
Data finalizare21 August 2023 - 21:00
Data contract22 August 2023 - 12:35
Valoare1.601,08 RON
Publicat
Modalitate de desfasurareOffline
Tipul contractuluiFurnizare
Cod CPVCategorie CPVINDUSTRIA PRELUCRATOARE
Autoritatea contractantaLocalitateMagurele, Ilfov
OfertantLocalitateUlm, Germany
Achizitii-