Prime Si + wet SiO2 wafer 2 inch, thinckness=279 ±25µm, (100), 1-side polished, p=type (Boron), TTV<10 µm, 1-10 Ohm cm, 500nm dry/wet/dry thermally grown SiO2, INV: 474597

    SEAP
    ID
    DAN1985776
    Data publicare
    22 August 2023 - 12:36
    Data finalizare
    21 August 2023 - 21:00
    Data contract
    22 August 2023 - 12:35
    Valoare
    1.601,08 RON
    Stare
    Publicat
    Modalitate de desfasurare
    Offline
    Tipul contractului
    Furnizare
    Cod CPVCategorie CPV
    INDUSTRIA PRELUCRATOARE
    Autoritatea contractantaLocalitate
    Magurele, Ilfov
    OfertantLocalitate
    Ulm, Germany
    Achizitii
    -